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IC Sockets
Home > Product > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Decoding the USB Standards from 1.0 to 4.0 Universal Serial Bus (USB) is arguably the most well-recognized interconnect standard on the market today. How did it get to where it is today? Learn More Taoglas Cable Builder Taoglas' cable builder allows users to customize and order coaxial cable assemblies to fit their specific needs. Learn More On-Demand Rising Demand for High-Speed / High-Bandwidth Interconnection Webinar 3M's on-demand webinar discusses how high-speed, high-bandwidth, and high-density interconnection help to keep up with evolving Ethernet and PCIe standards. Learn More

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Operating Temperature

-

-25u00b0C ~ 85u00b0C

-30u00b0C ~ 85u00b0C

-30°C ~ 85°C

-40u00b0C ~ 105u00b0C

-50u00b0C ~ 105u00b0C

-40u00b0C ~ 170u00b0C

-55u00b0C ~ 105u00b0C

-55u00b0C ~ 140u00b0C

-55u00b0C ~ 85u00b0C

-55°C ~ 105°C

-40u00b0C ~ 75u00b0C

-40°C ~ 80°C

-55u00b0C ~ 125u00b0C

-55u00b0C ~ 150u00b0C

-55°C ~ 125°C

-65u00b0C ~ 105u00b0C

-65u00b0C ~ 125u00b0C

-65u00b0C ~ 150u00b0C

-65u00b0C ~ 200u00b0C

105u00b0C

150u00b0C

-55u00b0C ~ 250u00b0C

-65°C ~ 200°C

-25u00b0C ~ 100u00b0C

-55u00b0C ~ 110u00b0C

-55°C ~ 150°C

-55°C ~ 175°C

-65°C ~ 175°C

-25°C ~ 100°C

0°C ~ 105°C

-50u00b0C ~ 175u00b0C

Package / Case

Manufacturer

Potter & Brumfield Relays / TE Connectivity

3M

Kycon

EDAC Inc.

Harwin

Samtec, Inc.

Adafruit

CnC Tech

Mill-Max

SparkFun

Adam Tech

Preci-Dip

Grayhill, Inc.

Omron Electronic Components

Aavid

Amphenol Aorora

WEC

Affinity Medical Technologies - Molex

Aries Electronics, Inc.

NTE Electronics, Inc.

Apex Microtechnology

Yamaichi Electronics

On-Shore Technology, Inc.

Luminary Micro/Texas Instruments

Keystone Electronics Corp.

ASSMANN WSW Components

AMP Connectors/TE Connectivity

Sullins Connector Solutions

Series

*

-

500

8400

600

700

800

CS

STA

BU

ED

PLS

111

317

321

346

522

ICS

110

400

511

513

515

516

518

SA

SKT

210

300

410

299

122

100

101

104

114

115

116

117

214

PCS

PX

22

WMS

550

PG

APA

127

121

123

124

523

HLS

217

324

326

501

505

508

514

D0

FCM

517

536

57

PKA

4800

IC

323

605

OEM

D2

940

PRL

223

8

PLCC

551

558

612

510

55

503

PRS

PGM

8060

540

917

126

547

712

316

MVAS

146

714

DMD

XR2

0503

0513

0517

105028

105142

105163

105167

105190

105199

105200

4038

47337

47594

47596

47989

537

546

614

6556

6621

69802

700 Elevator Strip-Lineu2122

78499

78725

8058

8059

8080

8180

Apex Precision Poweru00ae

APO

BU-178HT

Correct-A-Chipu00ae 1109800

D00

D01-950

D01-993

D01-995

D01-997

D26

D39

D73064

D830

D8864

D95

DILB

Diplomate DL

DPF3

Edge-Gripu2122, C81

Edge-Gripu2122, C91

EJECT-A-DIPu2122

HIC

ICA

iCF

ICM

ICO

LGH

Lo-PROu00aefile, 513

Lo-PROu00aefile, 526

Lo-PROu00aefile, C93

MHA

PGG

SBU

SIP050-1x

SIP1x

SMPX

SPF080-1x

Textoolu2122

Vertisocketsu2122 800

Product Status

Active

Discontinued at Digi-Key

Obsolete

Last Time Buy

Apply All
Quantity Available Price Series Product Status PackageTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
3-1437537-5

3-1437537-5

CONN IC DIP SOCKET 14POS GOLD

800

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

25.0u00b5in (0.63u00b5m)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

-

-

Polyester
3-1437537-0

3-1437537-0

CONN IC DIP SOCKET 14POS TINLEAD

800

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

-

-

-

Polyester
3-1437536-8

3-1437536-8

CONN IC DIP SOCKET 24POS GOLD

500

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

-

Brass

-
3-1437536-4

3-1437536-4

CONN IC DIP SOCKET 22POS GOLD

500

Obsolete

Tube

DIP, 0.4" (10.16mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Gold

25.0u00b5in (0.63u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

-

Brass

-
3-1437535-4

3-1437535-4

CONN SOCKET SIP 20POS GOLD

500

Obsolete

Bulk

SIP

20 (1 x 20)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

-
3-1437535-2

3-1437535-2

CONN SOCKET SIP 7POS GOLD

-

Obsolete

Bulk

SIP

7 (1 x 7)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

10.0u00b5in (0.25u00b5m)

Brass

Thermoplastic
3-1437535-1

3-1437535-1

CONN SOCKET SIP 20POS GOLD

-

Obsolete

Bulk

SIP

20 (1 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Thermoplastic, Polyester
3-1437532-4

3-1437532-4

CONN IC DIP SOCKET 28POS GOLD

500

Obsolete

-

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

-

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

-

-

-
3-1437532-0

3-1437532-0

CONN IC DIP SOCKET 28POS

-

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

-

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

-

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
3-1437531-7

3-1437531-7

CONN IC DIP SOCKET 14POS

500

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

-

-

Copper Alloy

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

-

Copper Alloy

-
3-1437530-3

3-1437530-3

CONN SOCKET SIP 16POS GOLD

500

Obsolete

Bulk

SIP

16 (1 x 16)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Thermoplastic
3-1437530-2

3-1437530-2

CONN SOCKET SIP 15POS

500

Obsolete

Bulk

SIP

15 (1 x 15)

0.100" (2.54mm)

-

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

-

-

Beryllium Copper

Thermoplastic
3-1437530-1

3-1437530-1

CONN SOCKET SIP 14POS GOLD

500

Obsolete

Bulk

SIP

14 (1 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Thermoplastic
3-1437521-9

3-1437521-9

STAMPED PIN

-

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
3-1437520-7

3-1437520-7

STAMPED PIN

-

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
3-1437520-6

3-1437520-6

STAMPED PIN

-

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
3-1437518-9

3-1437518-9

STAMPED PIN

*

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
3-1437508-9

3-1437508-9

CONN TRANSIST TO-5 8POS GOLD

8058

Obsolete

Bulk

Transistor, TO-5

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)
3-1437508-6

3-1437508-6

CONN TRANSIST TO-5 8POS GOLD

8058

Obsolete

Bulk Box

Transistor, TO-5

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)
3-1437508-1

3-1437508-1

CONN TRANSIST TO-5 8POS GOLD

8058

Active

Bulk Bulk

Transistor, TO-5

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)
3-1437504-6

3-1437504-6

CONN TRANSIST TO-3 3POS GOLD

8060

Obsolete

Bulk

Transistor, TO-3

3 (Oval)

-

Gold

50.0µin (1.27µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Gold

50.0µin (1.27µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)
2A8-4204-00

2A8-4204-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
299-PRS20009-12

299-PRS20009-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
299-PLS20009-12

299-PLS20009-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
299-99-210-12-001800

299-99-210-12-001800

CONN IC DIP SOCKET 10POS TINLEAD

299

Active

Tube

DIP, 0.2" (5.08mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Tin-Lead

100.0u00b5in (2.54u00b5m)

Beryllium Copper

Through Hole, Right Angle, Vertical

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-640-10-002000

299-93-640-10-002000

CONN IC DIP SOCKET 40POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-636-10-002000

299-93-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

36 (2 x 18)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-632-10-002000

299-93-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-630-10-002000

299-93-630-10-002000

CONN IC DIP SOCKET 30POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

30 (2 x 15)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-628-10-002000

299-93-628-10-002000

CONN IC DIP SOCKET 28POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-626-10-002000

299-93-626-10-002000

CONN IC DIP SOCKET 26POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-624-10-002000

299-93-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-622-10-002000

299-93-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-620-10-002000

299-93-620-10-002000

CONN IC DIP SOCKET 20POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-616-10-002000

299-93-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-614-10-002000

299-93-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-612-10-002000

299-93-612-10-002000

CONN IC DIP SOCKET 12POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-608-10-002000

299-93-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-324-11-001000

299-93-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-324-10-001000

299-93-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-320-11-001000

299-93-320-11-001000

CONN IC DIP SOCKET 20POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-320-10-001000

299-93-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-318-11-001000

299-93-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-318-10-001000

299-93-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-11-001000

299-93-316-11-001000

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-316-10-001000

299-93-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-314-11-001000

299-93-314-11-001000

CONN IC DIP SOCKET 14POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-314-10-001000

299-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-312-11-001000

299-93-312-11-001000

CONN IC DIP SOCKET 12POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-312-10-001000

299-93-312-10-001000

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-310-11-001000

299-93-310-11-001000

CONN IC DIP SOCKET 10POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-308-10-001000

299-93-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-306-11-001000

299-93-306-11-001000

CONN IC DIP SOCKET 6POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-93-306-10-001000

299-93-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-87-640-10-002101

299-87-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

36 (2 x 18)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-632-10-002101

299-87-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-630-10-002101

299-87-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

30 (2 x 15)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-628-10-002101

299-87-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-626-10-002101

299-87-626-10-002101

CONN IC DIP SOCKET 26POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-624-10-002101

299-87-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-622-10-002101

299-87-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-620-10-002101

299-87-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-618-10-002101

299-87-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-616-10-002101

299-87-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-614-10-002101

299-87-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-612-10-002101

299-87-612-10-002101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-610-10-002101

299-87-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-608-10-002101

299-87-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-11-001101

299-87-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-10-001101

299-87-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-320-11-001101

299-87-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-320-10-001101

299-87-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-318-11-001101

299-87-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-318-10-001101

299-87-318-10-001101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-316-11-001101

299-87-316-11-001101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-316-10-001101

299-87-316-10-001101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-314-11-001101

299-87-314-11-001101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-314-10-001101

299-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-312-11-001101

299-87-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-312-10-001101

299-87-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-310-11-001101

299-87-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-310-10-001101

299-87-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-308-11-001101

299-87-308-11-001101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-308-10-001101

299-87-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-11-001101

299-87-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-10-001101

299-87-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-210-10-001101

299-87-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-640-10-002101

299-83-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-636-10-002101

299-83-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

36 (2 x 18)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-632-10-002101

299-83-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-630-10-002101

299-83-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

30 (2 x 15)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-628-10-002101

299-83-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-626-10-002101

299-83-626-10-002101

CONN IC DIP SOCKET 26POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-624-10-002101

299-83-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-622-10-002101

299-83-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-620-10-002101

299-83-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-618-10-002101

299-83-618-10-002101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-616-10-002101

299-83-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-614-10-002101

299-83-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-612-10-002101

299-83-612-10-002101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-610-10-002101

299-83-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-608-10-002101

299-83-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-324-11-001101

299-83-324-11-001101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-324-10-001101

299-83-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-320-11-001101

299-83-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-320-10-001101

299-83-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-318-11-001101

299-83-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-318-10-001101

299-83-318-10-001101

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-316-11-001101

299-83-316-11-001101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-316-10-001101

299-83-316-10-001101

CONN IC DIP SOCKET 16POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-314-11-001101

299-83-314-11-001101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-314-10-001101

299-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-11-001101

299-83-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-10-001101

299-83-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-310-11-001101

299-83-310-11-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-310-10-001101

299-83-310-10-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-11-001101

299-83-308-11-001101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-10-001101

299-83-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-306-11-001101

299-83-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-306-10-001101

299-83-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-210-10-001101

299-83-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

299

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5u00b5in (0.75u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-43-640-10-002000

299-43-640-10-002000

CONN IC DIP SOCKET 40POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-636-10-002000

299-43-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

36 (2 x 18)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-630-10-002000

299-43-630-10-002000

CONN IC DIP SOCKET 30POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

30 (2 x 15)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-626-10-002000

299-43-626-10-002000

CONN IC DIP SOCKET 26POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-624-10-002000

299-43-624-10-002000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-622-10-002000

299-43-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-620-10-002000

299-43-620-10-002000

CONN IC DIP SOCKET 20POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-618-10-002000

299-43-618-10-002000

CONN IC DIP SOCKET 18POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-616-10-002000

299-43-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-614-10-002000

299-43-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-612-10-002000

299-43-612-10-002000

CONN IC DIP SOCKET 12POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-610-10-002000

299-43-610-10-002000

CONN IC DIP SOCKET 10POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

10 (2 x 5)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-608-10-002000

299-43-608-10-002000

CONN IC DIP SOCKET 8POS GOLD

299

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-324-11-001000

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-324-10-001000

299-43-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-320-10-001000

299-43-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-318-11-001000

299-43-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-318-10-001000

299-43-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-316-10-001000

299-43-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-314-10-001000

299-43-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-312-10-001000

299-43-312-10-001000

CONN IC DIP SOCKET 12POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

12 (2 x 6)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-308-10-001000

299-43-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-306-11-001000

299-43-306-11-001000

CONN IC DIP SOCKET 6POS GOLD

299

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-306-10-001000

299-43-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

299

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2900-9321-00-2431

2900-9321-00-2431

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
290-1294-00-3302J

290-1294-00-3302J

CONN IC DIP SOCKET ZIF 90POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP)

90 (2 x 45)

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
29-7XXXX-10

29-7XXXX-10

CONN SOCKET SIP 29POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-7625-10

29-7625-10

CONN SOCKET SIP 29POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-7600-10

29-7600-10

CONN SOCKET SIP 29POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-71250-10

29-71250-10

CONN SOCKET SIP 29POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-11H

29-0518-11H

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-11

29-0518-11

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10T

29-0518-10T

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10H

29-0518-10H

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10

29-0518-10

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-00

29-0518-00

CONN SOCKET SIP 29POS GOLD

518

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0511-11

29-0511-11

CONN SOCKET SIP 29POS GOLD

511

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0511-10

29-0511-10

CONN SOCKET SIP 29POS TIN

511

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0508-31

29-0508-31

CONN SOCKET SIP 29POS GOLD

508

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
29-0508-30

29-0508-30

CONN SOCKET SIP 29POS GOLD

508

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
29-0508-21

29-0508-21

CONN SOCKET SIP 29POS GOLD

508

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
29-0508-20

29-0508-20

X508 SMD SNG/DUAL SCKT WIRE WRAP

505

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
29-0501-31

29-0501-31

CONN SOCKET SIP 29POS GOLD

501

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-30

29-0501-30

CONN SOCKET SIP 29POS TIN

501

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-21

29-0501-21

CONN SOCKET SIP 29POS GOLD

501

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
29-0501-20

29-0501-20

CONN SOCKET SIP 29POS TIN

501

Active

Bulk

SIP

29 (1 x 29)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
289-PRS17001-16

289-PRS17001-16

CONN SOCKET PGA ZIF GOLD

PRS

Obsolete

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
289-PRS17001-12

289-PRS17001-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
289-PLS17001-16

289-PLS17001-16

CONN SOCKET PGA ZIF GOLD

PLS

Obsolete

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
289-PLS17001-12

289-PLS17001-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
288-4205-01

288-4205-01

CONN SOCKET QFN 88POS GOLD

Textoolu2122

Active

Bulk

QFN

88 (4 x 22)

0.016" (0.40mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.016" (0.40mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
2841-9047-90-2401

2841-9047-90-2401

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
284-6311-9UA-1902

284-6311-9UA-1902

GRID ZIP 11 X 11

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

84 (11 x 11)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
284-1273-00-1102JH

284-1273-00-1102JH

CONN SOCKET PLCC 84POS GOLD

OEM

Obsolete

Bulk

PLCC

84 (4 x 21)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
281-PRS19029-12

281-PRS19029-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PRS19012-12

281-PRS19012-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PRS19010-12

281-PRS19010-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PRS18037-12

281-PRS18037-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PLS19029-12

281-PLS19029-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PLS19012-12

281-PLS19012-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
281-PGM18037-11

281-PGM18037-11

CONN SOCKET PGA GOLD

PGM

Active

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
280-PRS19006-12

280-PRS19006-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
280-PLS19006-12

280-PLS19006-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
280-5205-01

280-5205-01

CONN SOCKET QFN 80POS GOLD

Textoolu2122

Active

Bulk

QFN

80 (4 x 20)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.020" (0.50mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
28-PGM06002-10

28-PGM06002-10

CONN SOCKET PGA GOLD

PGM

Active

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-31

28-C300-31

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-30

28-C300-30

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-21

28-C300-21

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-20

28-C300-20

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-11

28-C300-11

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-10

28-C300-10

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-00

28-C300-00

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-31

28-C212-31

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-30

28-C212-30

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-21

28-C212-21

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-20

28-C212-20

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-11

28-C212-11

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-10T

28-C212-10T

CONN IC DIP SOCKET 28POS TIN

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-10

28-C212-10

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-00

28-C212-00

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-31

28-C182-31

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-30

28-C182-30

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-21

28-C182-21

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-20

28-C182-20

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-11H

28-C182-11H

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-11

28-C182-11

DIP SOCKET

EJECT-A-DIPu2122

Active

-

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-00

28-C182-00

CONN IC DIP SOCKET 28POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8830-610C

28-8830-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8800-610C

28-8800-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8750-610C

28-8750-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8725-610C

28-8725-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8700-610C

28-8700-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8680-610C

28-8680-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8675-610C

28-8675-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8670-610C

28-8670-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8620-610C

28-8620-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8600-610C

28-8600-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8500-610C

28-8500-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8495-610C

28-8495-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8472-610C

28-8472-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8459-610C

28-8459-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8400-610C

28-8400-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8375-610C

28-8375-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8370-610C

28-8370-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8350-610C

28-8350-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8300-610C

28-8300-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8250-610C

28-8250-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-8240-610C

28-8240-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-823-90C

28-823-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-822-90C

28-822-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-820-90C

28-820-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-81250-610C

28-81250-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-81010-610C

28-81010-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-81000-610C

28-81000-610C

CONN IC DIP SOCKET 28POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-7XXXX-10

28-7XXXX-10

CONN SOCKET SIP 28POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-7850-10

28-7850-10

CONN SOCKET SIP 28POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-7770-10

28-7770-10

CONN SOCKET SIP 28POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-7750-10

28-7750-10

CONN SOCKET SIP 28POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6823-90T

28-6823-90T

CONN IC DIP SOCKET 28POS TIN

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
28-6823-90C

28-6823-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6823-90

28-6823-90

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
28-6822-90C

28-6822-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6820-90C

28-6820-90C

CONN IC DIP SOCKET 28POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6621-30

28-6621-30

CONN IC DIP SOCKET 28POS TIN

6621

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Bottom Entry; Through Board

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6575-18

28-6575-18

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6575-16

28-6575-16

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6575-11

28-6575-11

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6575-10

28-6575-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6574-18

28-6574-18

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6574-16

28-6574-16

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6574-11

28-6574-11

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6574-10

28-6574-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6573-18

28-6573-18

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6573-16

28-6573-16

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6573-11

28-6573-11

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6573-10

28-6573-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6572-18

28-6572-18

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6572-16

28-6572-16

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6572-11

28-6572-11

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6572-10

28-6572-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6571-16

28-6571-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-6571-11

28-6571-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6571-10

28-6571-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6570-16

28-6570-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-6570-11

28-6570-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6570-10

28-6570-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-41

28-6556-41

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder Cup

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-40

28-6556-40

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder Cup

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-31

28-6556-31

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-30

28-6556-30

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-21

28-6556-21

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-20

28-6556-20

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-11

28-6556-11

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6556-10

28-6556-10

CONN IC DIP SOCKET 28POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
28-6554-18

28-6554-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-6554-16

28-6554-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6554-11

28-6554-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6554-10

28-6554-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6553-18

28-6553-18

CONN IC DIP SOCKET ZIF 32POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6553-16

28-6553-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-6553-11

28-6553-11

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6553-10

28-6553-10

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6552-18

28-6552-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-6552-16

28-6552-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6552-11

28-6552-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6552-10

28-6552-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6551-18

28-6551-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-6551-16

28-6551-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6551-11

28-6551-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6551-10

28-6551-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-6518-11H

28-6518-11H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-112

28-6518-112

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-111

28-6518-111

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-11

28-6518-11

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10T

28-6518-10T

CONN IC DIP SOCKET 28POS GOLD

518

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10M

28-6518-10M

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10H

28-6518-10H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10E

28-6518-10E

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-102

28-6518-102

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-101

28-6518-101

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-10

28-6518-10

CONN IC DIP SOCKET 28POS GOLD

518

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-01

28-6518-01

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6518-00

28-6518-00

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-11H

28-6513-11H

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-11

28-6513-11

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-10T

28-6513-10T

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-10H

28-6513-10H

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-10

28-6513-10

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6511-11

28-6511-11

CONN IC DIP SOCKET 28POS GOLD

511

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6511-10

28-6511-10

CONN IC DIP SOCKET 28POS TIN

511

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-312

28-6508-312

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-311

28-6508-311

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-31

28-6508-31

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-302

28-6508-302

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-301

28-6508-301

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-30

28-6508-30

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-212

28-6508-212

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-211

28-6508-211

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-21

28-6508-21

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-202

28-6508-202

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-201

28-6508-201

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-20

28-6508-20

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6503-31

28-6503-31

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6503-30

28-6503-30

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6503-21

28-6503-21

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6503-20

28-6503-20

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-31

28-6501-31

CONN IC DIP SOCKET 28POS GOLD

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-21

28-6501-21

CONN IC DIP SOCKET 28POS GOLD

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-20

28-6501-20

CONN IC DIP SOCKET 28POS TIN

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-536-11

28-536-11

CONN SOCKET PLCC ZIF 28POS GOLD

536

Obsolete

-

PLCC, ZIF (ZIP)

28 (4 x 7)

0.050" (1.27mm)

Gold

12.0u00b5in (0.30u00b5m)

-

Through Hole

Open Frame

-

-

-

-

-

-
28-526-11

28-526-11

CONN IC DIP SOCKET ZIF 28POS GLD

Lo-PROu00aefile, 526

Active

Bulk

DIP, ZIF (ZIP)

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
28-526-10

28-526-10

CONN IC DIP SOCKET ZIF 28POS TIN

Lo-PROu00aefile, 526

Active

Bulk

DIP, ZIF (ZIP)

28 (2 x 14)

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
28-516-11S

28-516-11S

CONN IC DIP SOCKET ZIF 28POS GLD

516

Active

Bulk

DIP, ZIF (ZIP)

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
28-516-11

28-516-11

CONN IC DIP SOCKET ZIF 28POS GLD

516

Active

Bulk

DIP, ZIF (ZIP)

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
28-516-10

28-516-10

CONN IC DIP SOCKET ZIF 28POS TIN

516

Obsolete

Bulk

DIP, ZIF (ZIP)

28 (2 x 14)

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3575-18

28-3575-18

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3575-16

28-3575-16

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3575-11

28-3575-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3575-10

28-3575-10

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3574-18

28-3574-18

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3574-16

28-3574-16

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3574-11

28-3574-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3574-10

28-3574-10

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3573-16

28-3573-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-3573-11

28-3573-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3573-10

28-3573-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3572-16

28-3572-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-3572-11

28-3572-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3572-10

28-3572-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3571-16

28-3571-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-3571-11

28-3571-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3571-10

28-3571-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3570-16

28-3570-16

CONN IC DIP SOCKET ZIF 28POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
28-3570-11

28-3570-11

CONN IC DIP SOCKET ZIF 28POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3570-10

28-3570-10

CONN IC DIP SOCKET ZIF 28POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3554-18

28-3554-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-3554-16

28-3554-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3554-11

28-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3554-10

28-3554-10

28 PIN ZIF SOCKET TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3553-18

28-3553-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-3553-16

28-3553-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3553-11

28-3553-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3553-10

28-3553-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3552-18

28-3552-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-3552-16

28-3552-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3552-11

28-3552-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3552-10

28-3552-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3551-18

28-3551-18

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
28-3551-16

28-3551-16

CONN IC DIP SOCKET ZIF 28POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3551-11

28-3551-11

CONN IC DIP SOCKET ZIF 28POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3551-10

28-3551-10

CONN IC DIP SOCKET ZIF 28POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
28-3518-11H

28-3518-11H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-112

28-3518-112

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-111

28-3518-111

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-11

28-3518-11

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10TLH

28-3518-10TLH

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10T

28-3518-10T

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10M

28-3518-10M

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10H

28-3518-10H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10E

28-3518-10E

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-102

28-3518-102

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-101

28-3518-101

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10

28-3518-10

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-01

28-3518-01

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-00

28-3518-00

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-11H

28-3513-11H

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-11

28-3513-11

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10T

28-3513-10T

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10H

28-3513-10H

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10

28-3513-10

CONN IC DIP SOCKET 28POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-312

28-3508-312

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-311

28-3508-311

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-31

28-3508-31

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-302

28-3508-302

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-301

28-3508-301

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-30

28-3508-30

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-212

28-3508-212

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-211

28-3508-211

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-21

28-3508-21

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-202

28-3508-202

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-201

28-3508-201

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-20

28-3508-20

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-31

28-3503-31

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-30

28-3503-30

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-21

28-3503-21

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-3503-20

28-3503-20

CONN IC DIP SOCKET 28POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-11H

28-1518-11H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-11

28-1518-11

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10T

28-1518-10T

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10H

28-1518-10H

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10

28-1518-10

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-00

28-1518-00

CONN IC DIP SOCKET 28POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-1508-31

28-1508-31

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-1508-30

28-1508-30

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-1508-21

28-1508-21

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-1508-20

28-1508-20

CONN IC DIP SOCKET 28POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-0518-11H

28-0518-11H

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-11

28-0518-11

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10T

28-0518-10T

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10H

28-0518-10H

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10

28-0518-10

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-00

28-0518-00

CONN SOCKET SIP 28POS GOLD

518

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0511-11

28-0511-11

CONN SOCKET SIP 28POS GOLD

511

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0511-10

28-0511-10

CONN SOCKET SIP 28POS TIN

511

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0508-31

28-0508-31

CONN SOCKET SIP 28POS GOLD

508

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-0508-30

28-0508-30

CONN SOCKET SIP 28POS GOLD

508

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-0508-21

28-0508-21

CONN SOCKET SIP 28POS GOLD

508

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-0508-20

28-0508-20

CONN SOCKET SIP 28POS GOLD

508

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

501

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-30

28-0501-30

CONN SOCKET SIP 28POS TIN

501

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

501

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-20

28-0501-20

CONN SOCKET SIP 28POS TIN

501

Active

Bulk

SIP

28 (1 x 28)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
276-6321-9UA-1902

276-6321-9UA-1902

TEST BURN-IN PGA

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

76 (21 x 21)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
273-PRS21004-12

273-PRS21004-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
2728-9229-00-2401

2728-9229-00-2401

CONN SKT 1.27MM OT - T2

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
272-6325-9UA-1902

272-6325-9UA-1902

TEST BURN-IN PGA

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

72 (25 x 25)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
272-6311-9UA-1902

272-6311-9UA-1902

TEST BURN-IN PGA

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

72 (11 x 11)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
27-7XXXX-10

27-7XXXX-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-7580-10

27-7580-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-7550-10

27-7550-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-7530-10

27-7530-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-7500-10

27-7500-10

CONN SOCKET SIP 27POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-11H

27-0518-11H

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-11

27-0518-11

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10T

27-0518-10T

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10H

27-0518-10H

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10

27-0518-10

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-00

27-0518-00

CONN SOCKET SIP 27POS GOLD

518

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0511-11

27-0511-11

CONN SOCKET SIP 27POS GOLD

511

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0511-10

27-0511-10

CONN SOCKET SIP 27POS TIN

511

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0508-31

27-0508-31

CONN SOCKET SIP 27POS GOLD

508

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
27-0508-30

27-0508-30

CONN SOCKET SIP 27POS GOLD

508

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
27-0508-21

27-0508-21

CONN SOCKET SIP 27POS GOLD

508

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
27-0508-20

27-0508-20

CONN SOCKET SIP 27POS GOLD

508

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
27-0501-31

27-0501-31

CONN SOCKET SIP 27POS GOLD

501

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-30

27-0501-30

CONN SOCKET SIP 27POS TIN

501

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-21

27-0501-21

CONN SOCKET SIP 27POS GOLD

501

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-20

27-0501-20

CONN SOCKET SIP 27POS TIN

501

Active

Bulk

SIP

27 (1 x 27)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
268-6311-9UA-1902 GRID ZIP (11X11)

268-6311-9UA-1902 GRID ZIP (11X11)

TEXTOOL 268-6311-9UA-1902 PGA 11

-

Obsolete

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
268-5401-52-1102JH

268-5401-52-1102JH

CONN SOCKET CLCC 68POS GOLD

OEM

Obsolete

Bulk

CLCC

68 (4 x 17)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
268-5401-50-1102JH

268-5401-50-1102JH

CONN SOCKET CLCC 68POS GOLD

OEM

Obsolete

Bulk

CLCC

68 (4 x 17)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
268-5401-50-1102

268-5401-50-1102

3M TEXTOOL OEM LCC SOCKETS 268-5

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
268-5401-11-1102JH

268-5401-11-1102JH

CONN SOCKET CLCC 68POS GOLD

OEM

Obsolete

Bulk

CLCC

68 (4 x 17)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
268-5401-00-1102JH

268-5401-00-1102JH

CONN SOCKET CLCC 68POS GOLD

OEM

Obsolete

Tray

CLCC

68 (4 x 17)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
268-4204-01

268-4204-01

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
268-4204-00

268-4204-00

3M TEXTOOL 268-4204-00 QFN.4 MM

*

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2676-9318-C6-2401

2676-9318-C6-2401

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2676-9318-00-2401

2676-9318-00-2401

BGA SOCKET 1MM 676 POS 26X26

-

Obsolete

-

BGA

-

-

-

-

-

-

-

-

-

-

-

-

-
2676-929B-90-2401

2676-929B-90-2401

CONN SOCKET TEXTOOL PP16-106

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2641-9229-00-2401

2641-9229-00-2401

CONN SKT 1.27MM OTBGA TYPE

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
264-9389-90-2401

264-9389-90-2401

3M TEXTOOL 264-9389-90-2401 1.0M

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
264-9381-90-2401

264-9381-90-2401

BGA 1.00MM 9X9 8X8 64 PIN

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
264-5205-01

264-5205-01

CONN SOCKET QFN 64POS GOLD

Textoolu2122

Active

Bulk

QFN

64 (4 x 16)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.020" (0.50mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
264-4493-00-0602J

264-4493-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing

64 (2 x 32)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
264-4205-00

264-4205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
264-1300-00-0602J

264-1300-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing

64 (2 x 32)

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
2632-102-13

2632-102-13

SERIES 8XXX ELEVATOR SOCKET .200

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
262-PRS20003-12

262-PRS20003-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
262-PLS20003-12

262-PLS20003-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
260-5204-01

260-5204-01

CONN SOCKET QFN 60POS GOLD

Textoolu2122

Active

Bulk

QFN

60 (4 x 15)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.020" (0.50mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

Textoolu2122

Active

Bulk

QFN

60 (4 x 15)

0.016" (0.40mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.016" (0.40mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
26-8984-310C

26-8984-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8975-310C

26-8975-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8900-310C

26-8900-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8530-310C

26-8530-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8500-310C

26-8500-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8450-310C

26-8450-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-8350-310C

26-8350-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-823-90C

26-823-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-822-90C

26-822-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-820-90C

26-820-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-81250-610C

26-81250-610C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-81250-310C

26-81250-310C

CONN IC DIP SOCKET 26POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-7XXXX-10

26-7XXXX-10

CONN SOCKET SIP 26POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-7650-10

26-7650-10

CONN SOCKET SIP 26POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-7590-10

26-7590-10

CONN SOCKET SIP 26POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-7500-10

26-7500-10

CONN SOCKET SIP 26POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-71250-10

26-71250-10

CONN SOCKET SIP 26POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-6823-90T

26-6823-90T

CONN IC DIP SOCKET 26POS TIN

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
26-6823-90C

26-6823-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-6823-90

26-6823-90

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
26-6822-90C

26-6822-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-6820-90C

26-6820-90C

CONN IC DIP SOCKET 26POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-6621-30

26-6621-30

CONN IC DIP SOCKET 26POS TIN

6621

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Bottom Entry; Through Board

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-6513-11

26-6513-11

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11H

26-3513-11H

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-11

26-3513-11

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-10T

26-3513-10T

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-10H

26-3513-10H

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3513-10

26-3513-10

CONN IC DIP SOCKET 26POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-31

26-3503-31

CONN IC DIP SOCKET 26POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-30

26-3503-30

CONN IC DIP SOCKET 26POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-21

26-3503-21

CONN IC DIP SOCKET 26POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-3503-20

26-3503-20

CONN IC DIP SOCKET 26POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-11H

26-1518-11H

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-11

26-1518-11

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10T

26-1518-10T

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10H

26-1518-10H

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10

26-1518-10

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-00

26-1518-00

CONN IC DIP SOCKET 26POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-1508-31

26-1508-31

CONN IC DIP SOCKET 26POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-1508-30

26-1508-30

CONN IC DIP SOCKET 26POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-1508-21

26-1508-21

CONN IC DIP SOCKET 26POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-1508-20

26-1508-20

CONN IC DIP SOCKET 26POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

26 (2 x 13)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-0518-11H

26-0518-11H

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-11

26-0518-11

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10T

26-0518-10T

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10H

26-0518-10H

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10

26-0518-10

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-00

26-0518-00

CONN SOCKET SIP 26POS GOLD

518

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0511-11

26-0511-11

CONN SOCKET SIP 26POS GOLD

511

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0511-10

26-0511-10

CONN SOCKET SIP 26POS TIN

511

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0508-31

26-0508-31

CONN SOCKET SIP 26POS GOLD

508

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-0508-30

26-0508-30

CONN SOCKET SIP 26POS GOLD

508

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-0508-21

26-0508-21

CONN SOCKET SIP 26POS GOLD

508

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-0508-20

26-0508-20

CONN SOCKET SIP 26POS GOLD

508

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
26-0501-31

26-0501-31

CONN SOCKET SIP 26POS GOLD

501

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-30

26-0501-30

CONN SOCKET SIP 26POS TIN

501

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-21

26-0501-21

CONN SOCKET SIP 26POS GOLD

501

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-20

26-0501-20

CONN SOCKET SIP 26POS TIN

501

Active

Bulk

SIP

26 (1 x 26)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
257-PRS21015-12

257-PRS21015-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PRS21011-12

257-PRS21011-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PRS20018-12

257-PRS20018-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PRS20013-12

257-PRS20013-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PRS20012-12

257-PRS20012-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PLS20018-12

257-PLS20018-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PLS20013-12

257-PLS20013-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PLS20012-12

257-PLS20012-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
257-PGM20012-10

257-PGM20012-10

CONN SOCKET PGA GOLD

PGM

Obsolete

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
257-PGG20012-10

257-PGG20012-10

CONN SOCKET PGA GOLD

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2564-9225-00-2401

2564-9225-00-2401

CONN 1.27MM OTBGA TYPE II

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
256-PRS20005-12

256-PRS20005-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
256-PRS16001-12

256-PRS16001-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
256-PLS16001-12

256-PLS16001-12

CONN SOCKET PGA ZIF GOLD

PLS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
256-PG16001-10H

256-PG16001-10H

CONN SOCKET PGA GOLD

PG

Active

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
256-6313-9UA-1902

256-6313-9UA-1902

PGA 13 X 13

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

56 (13 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
256-5205-01

256-5205-01

3M TEXTOOL 256-5205-01 QFN .5 MM

*

Active

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
256-4205-01

256-4205-01

CONN SOCKET QFN 56POS GOLD

Textoolu2122

Active

Bulk

QFN

56 (4 x 14)

0.016" (0.40mm)

Gold

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.016" (0.40mm)

Gold

-

Beryllium Copper

Polyethersulfone (PES)
256-1292-00-0602J

256-1292-00-0602J

CONN IC DIP SOCKET ZIF 56POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

56 (2 x 28)

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
2552-111-13

2552-111-13

800 VERTISOCKET HORIZONTAL MOUNT

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
255-7322-52-0602

255-7322-52-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
255-7322-51-0602

255-7322-51-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
255-7322-02-0602

255-7322-02-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
255-7322-01-0602

255-7322-01-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2532-9628-00-2401

2532-9628-00-2401

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2529-9288-90-2401

2529-9288-90-2401

CONN SOCKET TEXTOOL PP16-105

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2528-1361-SB-3302

2528-1361-SB-3302

3M TEXTOOL TEST & BURN-IN SPGA S

-

Obsolete

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
252-4205-00

252-4205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
252-4204-00

252-4204-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
251-5949-52-0602

251-5949-52-0602

CONN ZIG-ZAG ZIF 51POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
251-5949-51-0602

251-5949-51-0602

CONN ZIG-ZAG ZIF 51POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
251-5949-02-0602

251-5949-02-0602

CONN ZIG-ZAG ZIF 51POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
251-5949-01-0602

251-5949-01-0602

CONN ZIG-ZAG ZIF 51POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

51 (1 x 25, 1 x 26)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
25-7XXXX-10

25-7XXXX-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7950-10

25-7950-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7846-10

25-7846-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7800-10

25-7800-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7787-10

25-7787-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7770-10

25-7770-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7750-10

25-7750-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7700-10

25-7700-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7677-10

25-7677-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7650-10

25-7650-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7625-10

25-7625-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7590-10

25-7590-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7500-10

25-7500-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7450-10

25-7450-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7435-10

25-7435-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7390-10

25-7390-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-7350-10

25-7350-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-71220-10

25-71220-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-71219-10

25-71219-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-71000-10

25-71000-10

CONN SOCKET SIP 25POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-11H

25-0518-11H

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-11

25-0518-11

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10T

25-0518-10T

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10H

25-0518-10H

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10

25-0518-10

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-00

25-0518-00

CONN SOCKET SIP 25POS GOLD

518

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0517-90C

25-0517-90C

CONN SOCKET SIP 25POS GOLD

0517

Active

Bulk

SIP

25 (1 x 25)

-

Gold

30.0µin (0.76µm)

Beryllium Copper

Through Hole, Right Angle

-

Solder

-

Tin

200.0µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-11H

25-0513-11H

CONN SOCKET SIP 25POS GOLD

0513

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-11

25-0513-11

CONN SOCKET SIP 25POS GOLD

0513

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-10T

25-0513-10T

CONN SOCKET SIP 25POS GOLD

0513

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-10

25-0513-10

CONN SOCKET SIP 25POS GOLD

0513

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

511

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0508-31

25-0508-31

CONN SOCKET SIP 25POS GOLD

508

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
25-0508-30

25-0508-30

CONN SOCKET SIP 25POS GOLD

508

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
25-0508-21

25-0508-21

CONN SOCKET SIP 25POS GOLD

508

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
25-0508-20

25-0508-20

CONN SOCKET SIP 25POS GOLD

508

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
25-0503-31

25-0503-31

CONN SOCKET SIP 25POS GOLD

0503

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
25-0503-30

25-0503-30

CONN SOCKET SIP 25POS GOLD

0503

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
25-0503-21

25-0503-21

CONN SOCKET SIP 25POS GOLD

0503

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
25-0503-20

25-0503-20

CONN SOCKET SIP 25POS GOLD

0503

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
25-0501-31

25-0501-31

CONN SOCKET SIP 25POS GOLD

501

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0501-30

25-0501-30

CONN SOCKET SIP 25POS TIN

501

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0501-21

25-0501-21

CONN SOCKET SIP 25POS GOLD

501

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
25-0501-20

25-0501-20

CONN SOCKET SIP 25POS TIN

501

Active

Bulk

SIP

25 (1 x 25)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
249-930X-XX-2401

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

Textoolu2122

Obsolete

-

BGA

49 (Verification Required)

0.039" (1.00mm)

Gold

-

-

Through Hole

Closed Frame

-

-

-

-

-

-
2485-111-13

2485-111-13

800 VERTISOCKET HORIZONTAL MOUNT

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2484-9314-01-2401

2484-9314-01-2401

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
248-5205-01

248-5205-01

CONN SOCKET QFN 48POS GOLD

Textoolu2122

Active

Bulk

QFN

48 (4 x 12)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
248-5205-00

248-5205-00

CONN SOCKET QFN 48POS GOLD

Textoolu2122

Active

Bulk

QFN

48 (4 x 12)

0.020" (0.50mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
248-4205-01

248-4205-01

CONN SOCKET QFN 48POS GOLD

Textoolu2122

Active

Bulk

QFN

48 (4 x 12)

0.016" (0.40mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
248-1282-00-0602J

248-1282-00-0602J

CONN IC DIP SOCKET ZIF 48POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

48 (2 x 24)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
245-40-1-06

245-40-1-06

CONN IC DIP SOCKET 40POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-32-1-06

245-32-1-06

CONN IC DIP SOCKET 32POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-28-1-06

245-28-1-06

CONN IC DIP SOCKET 28POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-24-1-06

245-24-1-06

CONN IC DIP SOCKET 24POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-22-1-03

245-22-1-03

CONN IC DIP SOCKET 22POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-20-1-03

245-20-1-03

CONN IC DIP SOCKET 20POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-18-1-03

245-18-1-03

CONN IC DIP SOCKET 18POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-16-1-03

245-16-1-03

CONN IC DIP SOCKET 16POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-14-1-03

245-14-1-03

CONN IC DIP SOCKET 14POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
245-08-1-03

245-08-1-03

CONN IC DIP SOCKET 8POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole, Kinked Pin

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
244A-6313-9UA-1902

244A-6313-9UA-1902

TEXTOOL

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

169 (13 x 13)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
244-5205-01

244-5205-01

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
244-5205-00

244-5205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2432-9235-01-2401

2432-9235-01-2401

CONN TEST & BURN-IN BGA SOCKET

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
243-48-1-06

243-48-1-06

CONN IC DIP SOCKET 48POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

48 (2 x 24)

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-40-1-06

243-40-1-06

CONN IC DIP SOCKET 40POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-32-1-06

243-32-1-06

CONN IC DIP SOCKET 32POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-28-1-06

243-28-1-06

CONN IC DIP SOCKET 28POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-24-1-06

243-24-1-06

CONN IC DIP SOCKET 24POS TIN

-

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-20-1-03

243-20-1-03

CONN IC DIP SOCKET 20POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-18-1-03

243-18-1-03

CONN IC DIP SOCKET 18POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-16-1-03

243-16-1-03

CONN IC DIP SOCKET 16POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-14-1-03

243-14-1-03

CONN IC DIP SOCKET 14POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-08-1-03

243-08-1-03

CONN IC DIP SOCKET 8POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
243-06-1-03

243-06-1-03

CONN IC DIP SOCKET 6POS TIN

-

Active

Tube

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
242A-6321-9UA-1902

242A-6321-9UA-1902

TEXTOOL PGA SKT

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

441 (21 x 21)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
242-1293-00-0602J

242-1293-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

42 (2 x 21)

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
242-1289-00-0602J

242-1289-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

42 (2 x 21)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
242-1281-00-0602J

242-1281-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

42 (2 x 21)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
241-48-1-06

241-48-1-06

CONN IC DIP SOCKET 48POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

48 (2 x 24)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-40-1-06

241-40-1-06

CONN IC DIP SOCKET 40POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-32-1-06

241-32-1-06

CONN IC DIP SOCKET 32POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-28-1-06

241-28-1-06

CONN IC DIP SOCKET 28POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

28 (2 x 14)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-24-1-06

241-24-1-06

CONN IC DIP SOCKET 24POS TIN

-

Obsolete

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-22-1-03

241-22-1-03

CONN IC DIP SOCKET 22POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

22 (2 x 11)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-20-1-03

241-20-1-03

CONN IC DIP SOCKET 20POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

20 (2 x 10)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-18-1-03

241-18-1-03

CONN IC DIP SOCKET 18POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

18 (2 x 9)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-16-1-03

241-16-1-03

CONN IC DIP SOCKET 16POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

16 (2 x 8)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-14-1-03

241-14-1-03

CONN IC DIP SOCKET 14POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

14 (2 x 7)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-08-1-03

241-08-1-03

CONN IC DIP SOCKET 8POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

8 (2 x 4)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
241-06-1-03

241-06-1-03

CONN IC DIP SOCKET 6POS TIN

-

Obsolete

Tube

DIP, 0.3" (7.62mm) Row Spacing

6 (2 x 3)

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60.0u00b5in (1.52u00b5m)

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
2400-9220-00-2401

2400-9220-00-2401

CONN SKT 1.27MM OTBGA TYPE

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
240-PRS20014-12

240-PRS20014-12

CONN SOCKET PGA ZIF GOLD

PRS

Active

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
240-5205-01

240-5205-01

CONN SOCKET QFN 40POS GOLD

Textoolu2122

Active

Bulk

QFN

40 (4 x 10)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
240-5205-00

240-5205-00

CONN SOCKET QFN 40POS GOLD

Textoolu2122

Active

Bulk

QFN

40 (4 x 10)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
240-4846-00-3303

240-4846-00-3303

CONN IC DIP SOCKET ZIF 40POS GLD

OEM

Obsolete

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

250.0u00b5in (6.35u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250.0u00b5in (6.35u00b5m)

Beryllium Copper

Polyether Imide (PEI), Glass Filled
240-4205-01

240-4205-01

3M TEXTOOL OPEN-TOP SOCKETS FOR

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
240-3639-00-0602J

240-3639-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
240-1288-00-0602J

240-1288-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
240-1280-00-0602J

240-1280-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

40 (2 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
24-PRS13096-16

24-PRS13096-16

CONN SOCKET PGA ZIF GOLD

PRS

Obsolete

Bulk

PGA, ZIF (ZIP)

-

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS)
24-C300-31

24-C300-31

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-30

24-C300-30

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-21

24-C300-21

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-20

24-C300-20

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-11

24-C300-11

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-10

24-C300-10

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C300-00

24-C300-00

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-31

24-C212-31

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-30

24-C212-30

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-21

24-C212-21

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-20

24-C212-20

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-11

24-C212-11

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-10

24-C212-10

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C212-00

24-C212-00

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-31

24-C182-31

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-30

24-C182-30

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-21

24-C182-21

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-20

24-C182-20

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-11H

24-C182-11H

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-11

24-C182-11

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-10H

24-C182-10H

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-00

24-C182-00

CONN IC DIP SOCKET 24POS GOLD

EJECT-A-DIPu2122

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8900-610C

24-8900-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8900-310C

24-8900-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8844-310C

24-8844-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8770-310C

24-8770-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8750-610C

24-8750-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8700-610C

24-8700-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8600-610C

24-8600-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8600-310C

24-8600-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8580-610C

24-8580-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8550-610C

24-8550-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8500-610C

24-8500-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8500-310C

24-8500-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8385-310C

24-8385-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8370-610C

24-8370-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8312-610C

24-8312-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8312-310C

24-8312-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8300-310C

24-8300-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8250-610C

24-8250-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8240-310C

24-8240-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-823-90C

24-823-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-822-90C

24-822-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-820-90C

24-820-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-8190-610C

24-8190-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81250-610C

24-81250-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81250-310C

24-81250-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81150-610C

24-81150-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81125-610C

24-81125-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81000-610C

24-81000-610C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-81000-310C

24-81000-310C

CONN IC DIP SOCKET 24POS GOLD

8

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame, Elevated

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-7XXXX-10

24-7XXXX-10

CONN SOCKET SIP 24POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-7500-10

24-7500-10

CONN SOCKET SIP 24POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-7445-10

24-7445-10

CONN SOCKET SIP 24POS TIN

700 Elevator Strip-Lineu2122

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Elevated

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6823-90T

24-6823-90T

CONN IC DIP SOCKET 24POS TIN

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
24-6823-90C

24-6823-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6823-90

24-6823-90

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6
24-6822-90C

24-6822-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6820-90C

24-6820-90C

CONN IC DIP SOCKET 24POS GOLD

Vertisocketsu2122 800

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6621-30

24-6621-30

CONN IC DIP SOCKET 24POS TIN

6621

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole, Bottom Entry; Through Board

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6575-18

24-6575-18

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6575-16

24-6575-16

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6575-11

24-6575-11

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6575-10

24-6575-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6574-18

24-6574-18

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6574-16

24-6574-16

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6574-11

24-6574-11

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6574-10

24-6574-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6573-16

24-6573-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-6573-11

24-6573-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6573-10

24-6573-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6572-16

24-6572-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-6572-11

24-6572-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6572-10

24-6572-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6571-16

24-6571-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-6571-11

24-6571-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6571-10

24-6571-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6570-18

24-6570-18

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-6570-16

24-6570-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-6570-11

24-6570-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6570-10

24-6570-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-41

24-6556-41

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder Cup

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-40

24-6556-40

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder Cup

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-31

24-6556-31

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-30

24-6556-30

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-21

24-6556-21

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-20

24-6556-20

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-11

24-6556-11

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6556-10

24-6556-10

CONN IC DIP SOCKET 24POS GOLD

6556

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyphenylene Sulfide (PPS), Glass Filled
24-6554-18

24-6554-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6554-11

24-6554-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6554-10

24-6554-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6553-18

24-6553-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-6553-16

24-6553-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6553-11

24-6553-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6553-10

24-6553-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6552-18

24-6552-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-6552-16

24-6552-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6552-10

24-6552-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6551-18

24-6551-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-6551-16

24-6551-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6551-11

24-6551-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6551-10

24-6551-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-6518-11H

24-6518-11H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-112

24-6518-112

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-111

24-6518-111

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-11

24-6518-11

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10T

24-6518-10T

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10M

24-6518-10M

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10H

24-6518-10H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10E

24-6518-10E

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-102

24-6518-102

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101H

24-6518-101H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-101

24-6518-101

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-10

24-6518-10

CONN IC DIP SOCKET 24POS GOLD

518

Active

Tube

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-01

24-6518-01

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-00

24-6518-00

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-11H

24-6513-11H

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-11

24-6513-11

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-10T

24-6513-10T

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-10H

24-6513-10H

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6513-10

24-6513-10

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6511-11

24-6511-11

CONN IC DIP SOCKET 24POS GOLD

511

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6511-10

24-6511-10

CONN IC DIP SOCKET 24POS TIN

511

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-312

24-6508-312

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-311

24-6508-311

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-31

24-6508-31

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-302

24-6508-302

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-301

24-6508-301

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-30

24-6508-30

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-212

24-6508-212

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-211

24-6508-211

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-21

24-6508-21

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-202

24-6508-202

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-201

24-6508-201

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6508-20

24-6508-20

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-31

24-6503-31

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-30

24-6503-30

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-21

24-6503-21

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-20

24-6503-20

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-31

24-6501-31

CONN IC DIP SOCKET 24POS GOLD

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-30

24-6501-30

CONN IC DIP SOCKET 24POS TIN

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-21

24-6501-21

CONN IC DIP SOCKET 24POS GOLD

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-6501-20

24-6501-20

CONN IC DIP SOCKET 24POS TIN

501

Active

Bulk

DIP, 0.6" (15.24mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-526-11

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Lo-PROu00aefile, 526

Active

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-526-10

24-526-10

CONN IC DIP SOCKET ZIF 24POS TIN

Lo-PROu00aefile, 526

Active

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-516-11S

24-516-11S

CONN IC DIP SOCKET ZIF 24POS GLD

516

Active

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-516-11M

24-516-11M

CONN IC DIP SOCKET ZIF 24POS GLD

516

Active

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-516-11

24-516-11

CONN IC DIP SOCKET ZIF 24POS GLD

516

Active

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-516-10

24-516-10

CONN IC DIP SOCKET ZIF 24POS TIN

516

Obsolete

Bulk

DIP, ZIF (ZIP)

24 (2 x 12)

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-11H

24-4518-11H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-11

24-4518-11

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10T

24-4518-10T

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10M

24-4518-10M

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10H

24-4518-10H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10E

24-4518-10E

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10

24-4518-10

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-01

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-00

24-4518-00

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-31

24-4508-31

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-30

24-4508-30

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-21

24-4508-21

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-4508-20

24-4508-20

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.4" (10.16mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3575-18

24-3575-18

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3575-16

24-3575-16

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3575-11

24-3575-11

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3575-10

24-3575-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3574-18

24-3574-18

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3574-16

24-3574-16

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3574-11

24-3574-11

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3574-10

24-3574-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3573-16

24-3573-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-3573-11

24-3573-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3573-10

24-3573-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3572-16

24-3572-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-3572-11

24-3572-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3572-10

24-3572-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3571-16

24-3571-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-3571-11

24-3571-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3571-10

24-3571-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3570-16

24-3570-16

CONN IC DIP SOCKET ZIF 24POS

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled
24-3570-11

24-3570-11

CONN IC DIP SOCKET ZIF 24POS GLD

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3570-10

24-3570-10

CONN IC DIP SOCKET ZIF 24POS TIN

57

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3554-18

24-3554-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-3554-16

24-3554-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3554-11

24-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3554-10

24-3554-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3553-18

24-3553-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-3553-16

24-3553-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3553-10

24-3553-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3552-18

24-3552-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-3552-16

24-3552-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3552-10

24-3552-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3551-18

24-3551-18

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled
24-3551-16

24-3551-16

CONN IC DIP SOCKET ZIF 24POS

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50.0u00b5in (1.27u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3551-10

24-3551-10

CONN IC DIP SOCKET ZIF 24POS TIN

55

Active

Bulk

DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled
24-3518-11H

24-3518-11H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-112

24-3518-112

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-111

24-3518-111

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-11

24-3518-11

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10T

24-3518-10T

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10M

24-3518-10M

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10H

24-3518-10H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10E

24-3518-10E

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-102

24-3518-102

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-101H

24-3518-101H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-101

24-3518-101

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10

24-3518-10

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-01

24-3518-01

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-00

24-3518-00

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11H

24-3513-11H

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11

24-3513-11

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-10T

24-3513-10T

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-10H

24-3513-10H

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-10

24-3513-10

CONN IC DIP SOCKET 24POS GOLD

Lo-PROu00aefile, 513

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-312

24-3508-312

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-311

24-3508-311

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-31

24-3508-31

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-302

24-3508-302

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-301

24-3508-301

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-30

24-3508-30

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-212

24-3508-212

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-211

24-3508-211

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-21

24-3508-21

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-202

24-3508-202

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-201

24-3508-201

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3508-20

24-3508-20

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-31

24-3503-31

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-21

24-3503-21

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-20

24-3503-20

CONN IC DIP SOCKET 24POS GOLD

503

Active

Bulk

DIP, 0.3" (7.62mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-11H

24-1518-11H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-11

24-1518-11

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10T

24-1518-10T

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10H

24-1518-10H

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10

24-1518-10

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-00

24-1518-00

CONN IC DIP SOCKET 24POS GOLD

518

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-1508-30

24-1508-30

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-1508-21

24-1508-21

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-1508-20

24-1508-20

CONN IC DIP SOCKET 24POS GOLD

508

Active

Bulk

DIP, 0.2" (5.08mm) Row Spacing

24 (2 x 12)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-0518-11H

24-0518-11H

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-11

24-0518-11

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-10T

24-0518-10T

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-10H

24-0518-10H

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-10

24-0518-10

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-00

24-0518-00

CONN SOCKET SIP 24POS GOLD

518

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0517-90C

24-0517-90C

CONN SOCKET SIP 24POS GOLD

0517

Active

Bulk

SIP

24 (1 x 24)

-

Gold

30.0µin (0.76µm)

Beryllium Copper

Through Hole, Right Angle

-

Solder

-

Tin

200.0µin (5.08µm)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-11H

24-0513-11H

CONN SOCKET SIP 24POS GOLD

0513

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-11

24-0513-11

CONN SOCKET SIP 24POS GOLD

0513

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10T

24-0513-10T

CONN SOCKET SIP 24POS GOLD

0513

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10H

24-0513-10H

CONN SOCKET SIP 24POS GOLD

0513

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10

24-0513-10

CONN SOCKET SIP 24POS GOLD

0513

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0511-11

24-0511-11

CONN SOCKET SIP 24POS GOLD

511

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0511-10

24-0511-10

CONN SOCKET SIP 24POS TIN

511

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50.0u00b5in (1.27u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-31

24-0508-31

CONN SOCKET SIP 24POS GOLD

508

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-0508-30

24-0508-30

CONN SOCKET SIP 24POS GOLD

508

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-0508-21

24-0508-21

CONN SOCKET SIP 24POS GOLD

508

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-0508-20

24-0508-20

CONN SOCKET SIP 24POS GOLD

508

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

-

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA46), Nylon 4/6
24-0503-31

24-0503-31

CONN SOCKET SIP 24POS GOLD

0503

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
24-0503-30

24-0503-30

CONN SOCKET SIP 24POS GOLD

0503

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
24-0503-21

24-0503-21

CONN SOCKET SIP 24POS GOLD

0503

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
24-0503-20

24-0503-20

CONN SOCKET SIP 24POS GOLD

0503

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Brass

Polyamide (PA), Nylon, Glass Filled
24-0501-31

24-0501-31

CONN SOCKET SIP 24POS GOLD

501

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-30

24-0501-30

CONN SOCKET SIP 24POS TIN

501

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-21

24-0501-21

CONN SOCKET SIP 24POS GOLD

501

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
24-0501-20

24-0501-20

CONN SOCKET SIP 24POS TIN

501

Active

Bulk

SIP

24 (1 x 24)

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Through Hole

-

Wire Wrap

0.100" (2.54mm)

Tin

200.0u00b5in (5.08u00b5m)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled
2396-9220-00-2411

2396-9220-00-2411

CONN SOCKET TEXTOOL PP15-194

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
239-5605-52-0602

239-5605-52-0602

CONN SOCKET 39POS ZIP STRIP

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
239-5605-51-0602

239-5605-51-0602

CONN SOCKET 39POS ZIP STRIP

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
239-5605-02-0602

239-5605-02-0602

CONN ZIG-ZAG 39POS GOLD

-

Active

Bulk

Zig-Zag

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
239-5605-01-0602

239-5605-01-0602

CONN ZIG-ZAG 39POS GOLD

-

Active

Bulk

Zig-Zag

39 (1 x 19, 1 x 20)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
2361-6319-9UA-1902

2361-6319-9UA-1902

GRID ZIP 19 X 19

Textoolu2122

Obsolete

Bulk

PGA, ZIF (ZIP)

361 (19 x 19)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polyethersulfone (PES)
236-6225-50-0602

236-6225-50-0602

SOCKET ZIP IN-LINE 36POS

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
236-6225-00-0602

236-6225-00-0602

CONN SOCKET SIP ZIF 36POS GOLD

Textoolu2122

Active

Bulk

SIP, ZIF (ZIP)

36 (1 x 36)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
2357-108-12

2357-108-12

EJECT-A-DP LCK/EJCT SCKT SLDR TL

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2352-9228-01-2401

2352-9228-01-2401

CONN SKT 1.27MM OTBGA TYPE II

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2352-9228-01-1401

2352-9228-01-1401

TEXTOOL 1.27 MM PITCH OPEN TOP B

-

Active

Box

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

-

Active

Tray

LGA

250 (16 x 25)

0.039" (1.00mm)

Gold

3.00u00b5in (0.076u00b5m)

Copper Alloy

Surface Mount

Board Guide, Open Frame

Solder

-

-

-

-

Thermoplastic
235-3019-52-0602

235-3019-52-0602

CONN ZIG-ZAG ZIF 35POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
235-3019-51-0602

235-3019-51-0602

CONN ZIG-ZAG ZIF 35POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
235-3019-02-0602

235-3019-02-0602

CONN ZIG-ZAG ZIF 35POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
235-3019-01-0602

235-3019-01-0602

CONN ZIG-ZAG ZIF 35POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

35 (1 x 17, 1 x 18)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
234-3034-52-0602

234-3034-52-0602

CONN ZIG-ZAG ZIF 34POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

34 (2 x 17)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
234-3034-51-0602

234-3034-51-0602

CONN ZIG-ZAG ZIF 34POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

34 (2 x 17)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
234-3034-02-0602

234-3034-02-0602

CONN ZIG-ZAG ZIF 34POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

34 (2 x 17)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
234-3034-01-0602

234-3034-01-0602

CONN ZIG-ZAG ZIF 34POS GOLD

Textoolu2122

Active

Bulk

Zig-Zag, ZIF (ZIP)

34 (1 x 34)

0.050" (1.27mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
233-PGM18039-51

233-PGM18039-51

CONN SOCKET PGA GOLD

PGM

Active

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
233-84

233-84

CONN SOCKET PLCC 84POS TIN

-

Obsolete

Tube

PLCC

84 (4 x 21)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-68

233-68

CONN SOCKET PLCC 68POS TIN

-

Obsolete

Tube

PLCC

68 (4 x 17)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-52

233-52

CONN SOCKET PLCC 52POS TIN

-

Obsolete

Tube

PLCC

52 (4 x 13)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-44

233-44

CONN SOCKET PLCC 44POS TIN

-

Obsolete

Tube

PLCC

44 (4 x 11)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-32

233-32

CONN SOCKET PLCC 32POS TIN

-

Obsolete

Tube

PLCC

32 (4 x 8)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-28

233-28

CONN SOCKET PLCC 28POS TIN

-

Obsolete

Tube

PLCC

28 (4 x 7)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
233-20

233-20

CONN SOCKET PLCC 20POS TIN

-

Obsolete

Tube

PLCC

20 (4 x 5)

0.050" (1.27mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Polybutylene Terephthalate (PBT), Glass Filled
2324-9021-02-2421

2324-9021-02-2421

3M TEXTOOL TEST & BURN-IN BALL G

*

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
2320-9220-02-2401

2320-9220-02-2401

CONN TEST & BURN-IN BGA SOCKET

-

Obsolete

Bulk

-

-

-

-

-

-

-

-

-

-

-

-

-

-
232-PGM17037-11

232-PGM17037-11

CONN SOCKET PGA GOLD

PGM

Active

Bulk

PGA

-

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

10.0u00b5in (0.25u00b5m)

Brass

Polyamide (PA46), Nylon 4/6, Glass Filled
232-84

232-84

CONN SOCKET PLCC 84POS TIN

-

Obsolete

Tube

PLCC

84 (4 x 21)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-68

232-68

CONN SOCKET PLCC 68POS TIN

-

Obsolete

Tube

PLCC

68 (4 x 17)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-5205-01

232-5205-01

CONN SOCKET QFN 32POS GOLD

Textoolu2122

Active

Bulk

QFN

32 (4 x 8)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polyethersulfone (PES)
232-52

232-52

CONN SOCKET PLCC 52POS TIN

-

Obsolete

Tube

PLCC

52 (4 x 13)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-44-TR

232-44-TR

CONN SOCKET PLCC 44POS TIN

-

Active

Tape & Reel (TR) Cut Tape (CT) Digi-Reelu00ae

PLCC

44 (4 x 11)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-44

232-44

CONN SOCKET PLCC 44POS TIN

-

Obsolete

Tube

PLCC

44 (4 x 11)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-32-TR

232-32-TR

CONN SOCKET PLCC 32POS TIN

-

Active

Tape & Reel (TR) Cut Tape (CT) Digi-Reelu00ae

PLCC

32 (4 x 8)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-32

232-32

CONN SOCKET PLCC 32POS TIN

-

Obsolete

Tube

PLCC

32 (4 x 8)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-28

232-28

CONN SOCKET PLCC 28POS TIN

-

Obsolete

Tube

PLCC

28 (4 x 7)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-2601-50-0602

232-2601-50-0602

IN-LINE ZIP STRIP POCKETS 32 CON

-

Active

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
232-2601-00-0602

232-2601-00-0602

CONN SOCKET SIP ZIF 32POS GOLD

Textoolu2122

Active

Bulk

SIP, ZIF (ZIP)

32 (1 x 32)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
232-20

232-20

CONN SOCKET PLCC 20POS TIN

-

Obsolete

Tube

PLCC

20 (4 x 5)

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

100.0u00b5in (2.54u00b5m)

Phosphor Bronze

Polyphenylene Sulfide (PPS), Glass Filled
232-1297-00-3303

232-1297-00-3303

CONN IC DIP SOCKET ZIF 32POS GLD

OEM

Obsolete

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

250.0u00b5in (6.35u00b5m)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

250.0u00b5in (6.35u00b5m)

Beryllium Copper

Polyether Imide (PEI), Glass Filled
232-1291-00-0602J

232-1291-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.070" (1.78mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
232-1287-00-0602J

232-1287-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

Textoolu2122

Active

Bulk

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled
232-1285-00-0602J

232-1285-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

Textoolu2122

Active

Tube

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

32 (2 x 16)

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Connector

Closed Frame

Press-Fit

0.100" (2.54mm)

Gold

30.0u00b5in (0.76u00b5m)

Beryllium Copper

Polysulfone (PSU), Glass Filled

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Tel.: +852-90512529

Email: info@compaqelectronics.com

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