IC Sockets

08-3518-10T

Price:

Series:

XR2

Product Status:

Active

Package:

Bulk

Type:

SIP

Number of Positions or Pins (Grid):

20 (1 x 20)

Pitch - Mating:

0.100" (2.54mm)

Contact Finish - Mating:

Gold

Contact Finish Thickness - Mating:

30.0u00b5in (0.76u00b5m)

Contact Material - Mating:

Beryllium Copper

Mounting Type:

Through Hole

Features:

Closed Frame

Termination:

Solder

Pitch - Post:

0.100" (2.54mm)

Contact Finish - Post:

Gold

Contact Finish Thickness - Post:

30.0u00b5in (0.76u00b5m)

Contact Material - Post:

Beryllium Copper

Housing Material:

Polybutylene Terephthalate (PBT), Glass Filled

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Compaq Electronics Asia Limited

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Email: info@compaqelectronics.com

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